LAM 839-101612-885
The LAM 839-101612-885 electrostatic chuck is a precision device used in semiconductor manufacturing processes to firmly adsorb wafers in a vacuum chamber. It uses high-precision mechanical structure and high-performance electrostatic adsorption technology
to ensure that the wafer maintains a stable position and state in the process of etching, deposition and other processes, so as to achieve high-precision and high-yield manufacturing.
Product parameters:
Size: Customized according to wafer size
Adsorption force: adjustable to meet different process requirements
Vacuum: High vacuum to ensure the cleanliness of the process environment
Compatibility: Compatible with all types of wafer materials and structures
Control mode: manual or automatic control
Specifications:
Materials: stainless steel, ceramic, etc
Processing technology: precision machining, surface treatment, etc
Quality standards: Meet the stringent requirements of semiconductor manufacturing processes
Application field:
LAM 839-101612-885 Electrostatic chucks are used in a wide range of semiconductor manufacturing processes, including:
etching
deposition
Thin film deposition
photoetching
Detection
cleanse
Product advantages:
High precision: Ensure the accuracy and stability of wafer positioning.
High yield: Reduce wafer breakage and defects and improve manufacturing yield.
Long life: The use of high-quality materials and reliable design to ensure the service life of the product.
Easy to use: easy to operate and easy to maintain.