LAM 719-101612-887
The LAM 719-101612-887 module is an electrostatic sucker (ESC) component manufactured by LAM Research Corporation for use in semiconductor wafer etching and ashing equipment. The module has a high clamping force for secure wafer clamping and a uniform electrostatic field for precise wafer alignment. In additio
n, its low particle production allows for clean treatment and is compatible with various etching and ashing chemicals. Its durable structure and long service life help to improve wafer etching and ashing process performance, thereby increasing wafer yield and product quality, reducing process defects and particle contamination, and reducing operating and maintenance costs1.
Product parameters:
The main parameters of the LAM 719-101612-887 module include:
Part number: 839-101612-8871.
Chuck size: 200mm1.
Voltage range: 0-1000V1.
Current capacity: 10A1.
Vacuum compatibility: Yes 1.
Coolant compatibility: Yes 1.