LAM 839-101612-887
The LAM 839-101612-887 electrostatic chuck is a precision device used in semiconductor manufacturi
ng processes to firmly adsorb wafers in a vacuum chamber. It uses high-precision mechanical structure and high-performance electrostatic adsorption technology to ensure that the wafer maintains a stable position and state in the process of etching, deposition and other processes, so as to achieve high-precision and high-yield manufacturing.
Product parameters:
Size: Customized according to wafer size
Adsorption force: adjustable to meet different process requirements
Vacuum: High vacuum to ensure the cleanliness of the process environment
Compatibility: Compatible with all types of wafer materials and structures
Control mode: manual or automatic control
Specifications:
Materials: stainless steel, ceramic, etc
Processing technology: precision machining, surface treatment, etc